PCB and thermal

Trace geometry, current capacity, impedance and getting heat off the board.

These calculators are in development. Below is what is being built for this category.

Coming next

  • Trace width for a target current and temperature rise, IPC-2221soon
  • Trace resistance and voltage drop at temperaturesoon
  • Via current capacity and thermal via arrayssoon
  • Microstrip and stripline characteristic impedancesoon
  • Differential pair geometry for a target differential impedancesoon
  • Creepage and clearance for a working voltagesoon
  • Copper area needed as a heatsink for a given dissipationsoon